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Failure mechanisms in chip-metallization in power applications

Camille Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

Degradation of the chip-metallization layer in power electronic packages under Active Power Cycling is still a major reliability concern. During Active Power Cycling tests, the chip acts as a heat source and temperature gradients develop within the package inducing stress and plastic deformation in…

2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Apr 2014, Ghent, Belgium. pp.1-5, ⟨10.1109/EuroSimE.2014.6813772⟩. ⟨hal-03474091⟩