Publications

Affichage de 4391 à 4400 sur 5525


  • COMM

Confrontation of Failure Mechanisms Observed during Active Power Cycling Tests with Finite Element Analyze Performed on a MOSFET Power Module

Camille Jeanne Margot Durand, Markus Klinger, Daniel Coutellier, Hakim Naceur

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a…

14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Apr 2013, Wrockaw, Poland. ⟨10.1109/EuroSimE.2013.6529900⟩. ⟨hal-03513207⟩

  • REPORT

Protocole expérimental et dispositif expérimental pour des essais préliminaires

Amal Saadé, Philippe Pudlo, Mathieu Lempereur, Olivier Rémy-Néris

[Rapport de recherche] Université de Valenciennes et du Hainaut-Cambrésis; LAMIH. 2013. ⟨hal-03475208⟩

  • ART

A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

Ahmed Eltawil, Michael Engel, Bibiche Geuskens, Amin Khajeh Djahromi, Fadi Kurdahi, Peter Marwedel, Smail Niar, Mazen Saghir

As systems-on-chip increase in complexity, the underlying technology presents us with significant challenges due to increased power consumption as well as decreased reliability. Today, designers must consider building systems that achieve the requisite functionality and performance using components…

Microprocessors and Microsystems: Embedded Hardware Design , 2013, Embedded Hardware Design, 37 (8), pp.760-771. ⟨10.1016/j.micpro.2013.07.008⟩. ⟨hal-03469465⟩